Payment Processing
PIN block encryption, card key management, and transaction signing rooted in Bastionchip HSM silicon. Replaces network HSM appliances with silicon co-located at point of transaction processing.
Use Cases
Financial Services
Replace network HSM appliances with silicon-native key custody. FIPS 140-3, PCI-HSM, and BSIMM compliance anchors built into the die.
Target certification
FIPS 140-3
Compliance Design Targets
Designed for the financial services regulatory landscape
These are design targets and intended certification paths, not current certifications. FIPS 140-3 Level 3 CMVP submission and Common Criteria evaluation are planned following first-silicon characterization. PCI-HSM design alignment is an architectural objective. Bastionchip makes no claim of current certification status for any standard.
FIPS 140-3 Level 3Physical security design — tamper-detection mesh, zeroize response, and key isolation required by Level 3.
PCI-HSM v3.0Payment key management and PIN block encryption capabilities aligned to PCI Security Standards Council HSM requirements.
DORA AlignmentEU Digital Operational Resilience Act — hardware-rooted key management supports ICT risk management requirements for EU financial entities.
BSIMM ControlsSoftware Security Initiative Maturity Model — hardware crypto foundation for key derivation and storage in BSIMM-assessed organizations.
Applications
Financial cryptography applications
Core Banking Key Custody
Master key storage and key-derivation functions for core banking systems. FIPS 140-3 physical security eliminates the trust boundary problem of software KMS in banking infrastructure.
Digital Asset Custody
Hardware-isolated private key storage for digital asset custody. Signing operations occur inside the tamper-protected silicon — private keys never exposed to host software.
Bring silicon-native HSM to your financial platform
Evaluation silicon available for qualified financial services design partners. NDA required. Compliance documentation on request.